Module integrity is lowered and power draw increased with this modification, in exchange for quicker boot up times and better thermal load handling.
- Power Draw
- +10%
- Integrity
- -5%
- Boot Time
- -8%
- Thermal Load
- -6%
- Shield Reinforcement
- +4%
微量元素 | 所需开销 |
---|---|
Specialised Legacy Firmware
|
1 |
实验性效果